In the modern age, the trend to design electronic products becomes thinner, lighter, shorter, & smaller. Due to the shrinking of the size of the electronic components, the drastic increase in the heat generation rate when evaluating with previous products. The heat sink component is the most common heat exchanger for CPUs and has been extensively exercised in order to provide cooling utility for electronic components. The conventional heat sink module utilized the natural as well as forced convection cooling technique; dissipate heat from CPUs to the ambient air. The combination of the heat sink and fan design usually involved in this forced convection cooling technique with variable speed of the fan regulating from 800 to 2000rpm. In this project Thermal analysis is carried out with Flotherm XT.  This project utilizes thermal analysis to identify a cooling solution for a desktop computer, which uses a 65 W CPU. The design is able to cool the chassis with heat sink joined to the CPU is adequate to cool the whole system. This work considers the circular cylindrical pin fins and rectangular plate heat sink fins design with aluminum base plate and the control of CPU heat sink processes.